勁拓股份(300400.SZ):公司半導體專用設備目前主要有半導體芯片封裝爐等
格隆匯7月13日丨勁拓股份(300400.SZ)近期在接待機構投資者調研時表示,公司半導體專用設備包括半導體熱工設備和半導體硅片製造設備,半導體熱工設備是用於芯片的先進封裝製造等生產環節的熱處理設備,半導體硅片製造設備則用於半導體硅片生產過程。公司半導體專用設備目前主要有半導體芯片封裝爐、Wafer Bumping 焊接設備、甩膠機、氮氣烤箱、半導體硅片製造設備等,目前主要對標美國、德國等國產品和技術較為成熟的品牌設備廠商。
公司半導體專用設備在技術和性能方面對標國外廠商,能夠滿足客户的短週期交付需求,同時具備價格優勢、快速響應的售後服務優勢。
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