江豐電子(300666.SZ):寧波江豐同芯半導體材料已掌握覆銅陶瓷基板DBC及AMB生產工藝
格隆匯6月15日丨江豐電子(300666.SZ)接受機構調研、現場參觀,問答交流中,就“陶瓷基板的生產工藝、市場前景如何?”
公司回覆稱,目前,陶瓷基板採用兩種主流的生產工藝,即DBC(Direct Copper Bond的簡稱)直接覆銅工藝和AMB(Active Metal Bonding的簡稱)活性金屬釺焊工藝。其中AMB基板結合強度更高,其耐高低温衝擊失效能力更強,隨着高鐵、新能源汽車、光伏等領域對於電壓等級的要求逐步提升,AMB基板已經成為第三代半導體和新型大功率電力電子器件IGBT的首選模組化材料。目前,全球AMB基板製造企業不多,以海外供應商為主。
公司控股子公司寧波江豐同芯半導體材料有限公司已經掌握覆銅陶瓷基板DBC及AMB生產工藝,主要產品為高端覆銅陶瓷基板,相關產品已初步獲得市場認可,未來發展目標是實現對第三代半導體用覆銅陶瓷基板的國產替代。
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