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江豐電子(300666.SZ):已掌握覆銅陶瓷基板DBC及AMB生產工藝,主要產品為高端覆銅陶瓷基板
格隆匯 06-09 20:05

格隆匯6月9日丨江豐電子(300666.SZ)於2023年6月7日-6月8日接受機構調研、現場參觀,交流環節中,就“公司佈局陶瓷基板領域的契機?發展現狀如何?”,公司回覆稱,公司持續關注第三代半導體的發展情況。近年來,隨着半導體產業鏈國產替代加速,且新能源汽車、軌道交通、特高壓、5G通訊等新興領域高速發展,市場對陶瓷基板的需求量快速提升。公司通過控股子公司寧波江豐同芯半導體材料有限公司從事第三代半導體芯片模組及大功率半導體模塊相關核心原材料的研發和生產,已經掌握覆銅陶瓷基板DBC及AMB生產工藝,主要產品為高端覆銅陶瓷基板。目前,相關產品已初步獲得市場認可。

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