公司問答 | 長電科技:面向高算力芯片領域推出了Chiplet高性能封裝技術平台XDFOI
格隆匯5月19日丨有投資者在互動平台向長電科技提問:請問公司有無佈局算力方面內容?長電科技迴應:共公司面向高算力芯片領域推出了Chiplet高性能封裝技術平台XDFOI。目前,長電科技高密度扇出型集成封裝技術可提供從設計到生產的交鑰匙服務,助力客户顯著提升芯片系統集成度,為高性能計算應用提供卓越的微系統集成解決方案。公司在算力芯片相關的大尺寸倒裝及晶圓級扇出型封裝已經積累多年的量產經驗,並一直與不同的晶圓廠在最先進製程的硅節點上進行合作,公司也正持續投入算力芯片相關的多樣化解決方案的開發及相關產能建設。
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