日本鎧俠和西部數據計劃合併，半導體ETF飄紅
今日早盤半導體板塊拉昇，午後升幅進一步擴大。江波龍升超12%，深科技一字板升停，東芯股份升超7%，德明利升超65,長電科技、拓荊科技、長川科技、中微公司等跟升。
ETF方面,工銀瑞信半導體龍頭ETF、華泰柏瑞中韓半導體ETF升0.95%，鵬華基金半導體ETF、國聯安基金半導體ETF等跟升。
消息面上，由於存儲芯片需求下滑，日本鎧俠和美國存儲芯片製造商西部數據正在加快合併談判並敲定交易結構。因此今日A股的芯片板塊中，存儲芯片方向領升。
受該消息影響，隔夜美股市場芯片股普升。費城半導體指數升2.7%，重上3000點至四周新高。西部數據升超11%至五週最高，AMD轉升超2%至一個半月高位，英偉達轉升超2%至一週新高。
日本鎧俠和西部數據計劃合併的時間反映出的行業現狀非常值得關注。週期底部的信號不外乎出清、併購重組。從SK海力士收購英特爾閃存，到西數收購鎧俠，很大程度上意味着週期逐步見底。
從股市交易風格來看，近期市場處於縮量震盪的態勢，昨日在大金融板塊的帶動下，成交量放大至9000億，但仍沒有重回萬億的交投活躍水平，總體交易邏輯圍繞低價板塊輪動。
而半導體板塊已經連續下挫五週，資金不斷借道ETF抄底.
上週資金淨流入前列的為跟蹤科創50、半導體芯片的ETF。
份額方面，科創50ETF和創業板ETF分別增加了56.75億份、16.34億份。其中，上週華夏科創50ETF基金份額全市增長最多，上週累計增長56.75億份。
目前市面上有多隻半導體、芯片相關的ETF產品，其中規模超百億的有國聯安基金半導體ETF、國泰基金芯片ETF以及華夏芯片ETF，其中國聯安基金ETF規模最大，最新數據高達255.07億元。
截至5月14日，今年半導體ETF、芯片ETF合計份額增長高達215億份。
值得關注的一點是，根據G7廣島峯會日程，5月20日，G7擬磋商強化半導體供應鏈等經濟安全，需要跟蹤會議對此形成的最新政策。
對於半導體板塊後續的投資，市場的觀點也是積極樂觀的。諾安基金蔡嵩松在諾安成長的一季報中寫道，主要佈局芯片板塊，在當前的市場位置，迎接即將到來的科技大行情。
他還談及芯片板塊的兩大細分領域芯片設計板塊和芯片設備材料EDA，在一季度都到了臨近拐點的階段。認為在全球晶圓擴產處於下行週期的大背景下，國產替代進程加速對設備材料EDA板塊的拉動，很可能會超預期。
國金證券認為，整體來看，23Q1是行業業績低點，後面將逐季向上，下半年有望在需求回暖+補庫存的拉動下迎來業績向上拐點。
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