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雅克科技(002409.SZ):半導體制程光刻膠研發工作按計劃推進中
格隆匯 05-06 16:52

格隆匯5月6日丨有投資者在投資者互動平台向雅克科技(002409.SZ)提問,“請問: 1)HBM會用到哪類前驅體,特種氣體,公司有相關產品儲備及出貨嗎? 2)通過收購方式進入面板光刻膠,有在佈局半導體光刻膠嗎? 3)現有四氟化碳年產能多少?在建及規劃產能多少,預期何時投產呢? 4)請問LDS設備是什麼?屬於電子材料還是半導體設備或零部件呢? 5)前驅體下游存儲和邏輯佔比大概多少,或者誰多誰少呢?”

雅克科技回覆稱,公司半導體制程光刻膠研發工作按計劃推進中。公司下屬子公司成都科美特高純四氟化碳的產能為2000 T/年。公司的LDS輸送系統主要用於半導體和顯示面板製造商的前驅體材料等化學品的輸送。

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