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國芯科技(688262.SH):第一代量產版Raid芯片已正式投片
格隆匯 02-28 15:29

格隆匯2月28日丨國芯科技(688262.SH)於2023年2月接受機構調研時表示,公司Raid芯片開發進展順利,在原來Raid芯片初樣的基礎上,公司廣泛徵求客户的意見和建議,積極進行了新的設計,以更好地滿足客户實際的需求。目前修改設計已經完成,第一代量產版Raid芯片已正式投片。在此基礎上,公司正在瞄準國際一流公司產品水平,積極開展第二代Raid芯片的設計工作,將採用12nm先進工藝技術和高性能高速接口IP技術實現高性能Raid芯片,為我國服務器Raid芯片的國產化替代和信創事業的發展做出努力。

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