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華虹半導體(01347.HK)與華虹宏力、國家集成電路產業基金II及無錫市實體將投資40億美元成立合營企業以擴大晶圓產能
格隆匯 01-18 17:50

格隆匯1月18日丨華虹半導體(01347.HK)發佈公吿,公司、華虹宏力、國家集成電路產業基金II及無錫市實體於2023年1月18日訂立合營協議,據此,公司、華虹宏力、國家集成電路產業基金II及無錫市實體有條件同意透過合營公司華虹半導體制造(無錫)有限公司成立合營企業並以現金方式分別向合營公司投資8.8億美元、11.7億美元、11.66億美元及8.04億美元。

根據合營協議,合營公司將從事集成電路及採用65/55nm至40nm工藝的12英寸(300mm)晶圓的製造及銷售。

同日,公司、華虹宏力、國家集成電路產業基金II、無錫市實體及合營公司訂立合營投資協議以將合營公司轉為合營企業並將合營公司的註冊資本由人民幣6.68百萬元增至40.2億美元。

合營公司與華虹無錫於2023年1月18日訂立土地轉讓協議,據此,華虹無錫有條件同意轉讓,而合營公司有條件同意以總代價人民幣1.7億元購買該土地,以開發晶圓廠,從而容納合營公司製造集成電路及12英寸(300mm)晶圓的生產線。標的事項:位於中國江蘇省無錫市新洲路28及30號及錫興路27及29號249,049平方米的多幅土地的部分土地使用權。

儘管華虹無錫持續進行產能擴充,但鑑於近年來對半導體的需求依舊強勁,其無法滿足市場增長。華虹無錫的晶圓廠產能利用率保持在一個非常高的水平。鑑於華虹無錫的強勁表現及公司“8英寸+12英寸”的企業戰略,公司於2023年將繼續擴大其生產線的產能。合營協議及合營投資協議符合公司的戰略,以強化其在各類晶圓領域的市場地位及競爭力。

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