鵬鼎控股(002938.SZ):擬以1.36億美元投資禮鼎半導體、其專注於高階半導體封裝載板的研產銷
格隆匯1月12日丨鵬鼎控股(002938.SZ)公佈,公司於2023年1月12日召開第二屆董事會第二十三次會議,審議通過了《關於投資關聯公司禮鼎半導體科技(深圳)有限公司的議案》:
為了加強公司在半導體領域的投資佈局,公司擬與關聯公司禮鼎半導體科技(深圳)有限公司(“禮鼎半導體”)簽訂《投資入股協議書》,禮鼎半導體擬通過此次增資新增2159.05萬美元註冊資本,其中由公司以貨幣方式認繳其中的1511.335萬美元註冊資本。剩餘新增註冊資本由其他投資人認繳(其他投資方暫未確定)。
根據以上協議,公司此次將向禮鼎半導體增資13602.0151萬美元,其中,1511.3350萬美元計入禮鼎半導體的註冊資本,剩餘款項全部計入資本公積。禮鼎半導體現有股東同意公司對其股權進行調整並且確認放棄對此次增資所涉新增出資的優先認購權。增資完成後,公司持有禮鼎半導體8.47%的股權。
禮鼎半導體控股股東Monterey Park Finance Ltd.,持有公司控股股東美港實業有限公司100%股權。因此此次交易構成關聯交易。
封裝載板作為半導體封裝的關鍵材料,廣泛應用於高速計算、5G、AI、IoT、車用電子等領域芯片的封裝中。近年來,隨着以封裝基板為基礎的先進封裝市場的快速發展併成為主要的封裝類別,封裝基板進入高速發展期,市場前景良好,公司長期看好半導體封裝載板市場的發展。為了及時掌握半導體技術的發展趨勢,公司計劃在半導體領域進行戰略佈局。
禮鼎半導體專注於高階半導體封裝載板的研發、生產和銷售。通過投資禮鼎半導體,一方面有助於公司藉此加大半導體領域的戰略佈局,充分把握電子行業的技術發展趨勢,符合公司的戰略發展方向;另一方面公司可與禮鼎半導體深化在生產管理及高端製造等方面學習互鑑,充分發揮協同效應,提升公司的市場競爭優勢。
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