博敏電子(603936.SH):擬投資60億元建博敏IC封裝載板產業基地項目
格隆匯5月25日丨博敏電子(603936.SH)公佈,公司與合肥經濟技術開發區管理委員會(“合肥經開區管委會”)於近日簽署了《博敏IC封裝載板產業基地項目戰略合作協議》。為響應市場需求,雙方在相互信任的基礎上,致力於建立長期合作伙伴關係,不斷拓展合作的廣度和深度,打造國際一流的IC封裝載板產業基地項目,實現互利共贏。
公司計劃在合肥經開區投資建設博敏IC封裝載板產業基地項目,總投資約60億元人民幣,佔地約200畝,項目分兩期建設,第一期總投資30億元,第二期總投資30億元,上述投資金額僅為初步預估金額,實際以正式簽署的投資協議為準。項目主要從事高端高密度封裝載板產品生產,應用領域涵括存儲器芯片、微機電系統芯片、高速通信市場及MiniLED等。
一期計劃2022年開工建設,二期計劃2025年開工建設,其中,一期項目全部達產後,預計可實現年銷售額31億元,年税收1.75億元,新增就業崗位需求3000人。
公司具備成熟和先進的HDI生產工藝,在此基礎上從2018年開始在管理、人才和技術等方面進行IC載板項目的籌備和投入,目前團隊成員囊括國內外IC載板領域的專家,具備豐富的IC載板生產和製造經驗,已具備量產能力。本次與開發區管委會建立戰略合作關係開展IC封裝載板項目,將極大增強公司在集成電路領域高端電子電路產品研發與製造方面的技術水平,同時也會帶動公司在原有高多層、HDI等傳統電路板製造方面的實力提升,從而實現公司業務領域拓展,增強市場競爭力,助力公司持續高質量的良性發展,符合公司長遠發展戰略規劃。
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