捷捷微電(300623.SZ):子公司捷捷半導體取得2項發明專利證書
格隆匯11月12日丨捷捷微電(300623.SZ)公佈,公司全資子公司捷捷半導體有限公司於近日取得中華人民共和國國家知識產權局頒發的兩項發明專利證書,發明名稱為一種電極片與半導體器件,一種芯片封裝結構及其製作方法。
本發明提供了一種電極片與半導體器件,涉及半導體技術領域。該電極片包括多個散熱元與連筋,散熱元呈陣列排布,且相鄰兩個散熱元通過一條連筋連接,其中,散熱元的形狀為多邊形,連筋與散熱元之間成鋭角設置。本發明的電極片與半導體器件具有不易出現芯片損壞的優點。
本發明提供了一種芯片封裝結構及其製作方法,涉及芯片塑封技術領域。該芯片封裝結構包括塑封體、至少兩個半導體芯片、至少一箇中間電極片、第一外側電極片以及第二外側電極片,相鄰兩個半導體芯片之間至少包括一箇中間電極片,第一外側電極片與第二外側電極片分別位於至少兩個半導體芯片的最外側,塑封體套設於至少兩個半導體芯片、至少一箇中間電極片、第一外側電極片以及第二外側電極片外;其中,中間電極片的第一散熱面穿過塑封體並裸露於塑封體的外側。本發明提供了一種芯片封裝結構及其製作方法具有體積小,散熱能力強的優點。
上述發明專利的取得和運用,有利於公司進一步完善知識產權保護體系,形成持續創新機制,鞏固和保持技術領先地位,提升公司的核心競爭力。
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