SEMI:料2023年功率暨化合物半導體月產能衝破1000萬片
格隆匯10月13日丨SEMI(國際半導體產業協會)13日指出,隨着疫後汽車電子產品需求復甦,2023 年全球功率暨化合物半導體元件晶圓月產能將首次挑戰千萬片大關,相當於1024萬片8寸晶圓,2024年也將持續增長至1060萬片。SEMI表示,全球功率暨化合物半導體元件的晶圓產能去年年增3%,預計今年將有7%的顯著增長,2022年及2023年將持續攀升,年增率分別達 6%、5%。SEMI全球行銷長暨台灣區總裁表示,寬能隙先進材料如碳化硅(SiC)與氮化鎵 (GaN),近一年來積極導入動力總成(Powertrain)、電動車車載充電器(EV OBC)、光達 (LiDAR)、5G基地台等高階應用領域,顯見其未來在汽車電子產品、再生能源、國防與航太等應用的重要性已不言而喻。依地區別來看,2023年中國將為全球功率暨化合物半導體產能最大的地區,達33%,其次是日本的17%,歐洲和中東地區16%,台灣則約11%,預計至 2024年各地區比重仍與先前相當。SEMI補充,2021至2024年63家公司月產能將增加超過200萬片8寸晶圓,其中,英飛凌(IFNNY.US)、華虹(1347.HK)、意法半導體(STM.US)和士蘭微電子(600460.SH)合計就增加達70萬片。
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