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臺積電料明年完成5納米系統整合單芯片開發
阿思達克 09-23 16:20
臺灣傳媒報道,臺積電(TSM.US)先進封裝技術暨服務副總經理廖德堆在一個論壇上表示,隨着先進製程技術朝3納米或以下推進時,具有先進封裝的小晶片概念,已成爲必要的解決方案,公司去年製程技術已發展至5納米,預計在明年完成5納米的系統整合單芯片(SoIC)開發。他說,爲了達到先進小晶片封裝製造的上市時間、量產和良率目標,公司正打造創新的3D Fabric先進封測製造基地,將採全自動化。 廖德堆說,臺積電的3D Fabric先進封測製造基地,包括先進測試、SoIC和2.5D先進封裝(InFO、CoWoS)廠房;其中的SoIC廠房將於今年導入機臺,預計2.5D先進封裝廠房明年完成。
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