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進擊的英特爾:贏得美國國防項目
uSMART盈立智投 08-24 22:24

美國當地時間週一,英特爾(INTC.US)表示,其將在美國國防部一項計劃的第一階段提供商業晶圓代工服務,該計劃旨在製造美國國防部系統所需的電路和商業產品。據悉,該計劃名爲“快速保證微電子原型-商業計劃”(RAMP-C),目的是強化美國國內的半導體供應鏈建設力度。作爲計劃的一部分,英特爾晶圓代工服務部門將與IBM Corp(IBM.US)、新思科技(SNPS.US)、Cadence以及其他公司合作,在美國國內建設商業化芯片生產生態系統。

此外,英特爾最近宣佈將投資約200億美元,在亞利桑那州新建兩座芯片工廠,從而成爲美國國內芯片製造客戶的主要提供商。該公司表示,這些工廠將爲其不斷擴大的產品需求提供支持。

智通財經APP瞭解到,除了英特爾之外,大多數美國芯片設計公司都是無晶圓廠的,這意味着雖然這些公司設計和銷售集成電路,但這些集成電路是由被稱爲晶圓廠的合同製造商製造的,而且,市場上超過80%的尖端芯片製造商集中在亞洲。

英特爾與美國國防部的這一合作正值全球芯片短缺之際。芯片短缺一定程度上受到了疫情的影響,同時也對全球供應鏈產生衝擊。英特爾和其他科技及汽車巨頭都在就可能的解決方案與白宮就芯片短缺展開持續溝通。英特爾CEO Pat Gelsinger上月與拜登政府官員舉行會面,探討了建設更多芯片工廠的計劃,以期獲得更多補貼。

Gelsinger在有關RAMP-C的最新的聲明中表示,過去一年最深刻的教訓之一是半導體的戰略重要性,以及擁有強大國內半導體產業對美國的價值。英特爾是唯一一家同時設計和製造處於技術前沿的邏輯半導體的美國公司。今年早些時候,當公司推出英特爾代工服務時,該公司很高興有機會將其能力提供給包括美國政府在內的更廣泛的合作夥伴,同時也很高興看到通過RAMP-C這樣的計劃實現了這一潛力。

英特爾代工服務部門總裁Randhir Thakur在一份聲明中表示,RAMP-C計劃將使商業代工客戶和美國國防部都能利用英特爾在尖端工藝技術上的重大投資。

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