東山精密(002384.SZ):擬投資不超15億元設子公司從事IC載板研發、設計、生產和銷售
格隆匯7月28日丨東山精密(002384.SZ)公佈,公司作為全球領先的電子電路研發、設計、生產、銷售企業,為進一步鞏固和提升行業地位,拓寬高端電子電路產品體系,更好的服務全球優質客户,公司擬投資設立全資子公司專業從事IC載板的研發、設計、生產和銷售,投資總額不超過人民幣15億元。
IC載板是集成電路產業鏈封測環節關鍵載體。隨着人工智能、物聯網、汽車智能化等新興技術的推動,疊加第五代通訊技術的不斷推廣,高性能芯片、5G基站、5G AiP 模組等電子元件市場應用的持續擴張以及國內 IDM 和晶圓代工廠產能的逐漸釋放,封裝測試需求將呈高速增長的態勢,預計 IC 載板的需求也將隨之大幅度提升。IC 載板將持續引領電子電路行業的增長。
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