立昂微(605358.SH)：擬轉讓立昂東芯9%股權予汪耀祖等核心技術團隊擁有的合夥企業
格隆匯 2 月 8日丨立昂微(605358.SH)公佈，公司擬將持有的杭州立昂東芯微電子有限公司(“立昂東芯”)9%的股權以1元的價格轉讓予汪耀祖等核心技術團隊共同出資擁有的有限合夥企業——杭州耀高企業管理合夥企業(有限合夥)，股權轉讓完成後，公司對立昂東芯的持股比例變更為86.2111%。
由汪耀祖等人組成的技術團隊是由海內外技術精英構成，主要成員具有海外留學經歷，以及在國際知名公司十多年的行業工作經驗。整個技術團隊擁有資深的化合物半導體器件和加工製造技術背景，每個人都有其自身的技術特長，主要涵蓋基體材料(主要覆蓋砷化鎵、氮化鎵、磷化銦等)、製造工藝技術(主要覆蓋HBT、pHEMT、MESFET、LED、VECSEL、CPV等)、工業工程和品質管理(主要覆蓋光刻、電鍍、薄膜材料、幹法刻蝕、濕法刻蝕等)等領域。他們在工藝整合、控制工藝參數、提高產率、可靠性和產品質量管理上有着豐富的實踐經驗。
立昂東芯是一家專業從事砷化鎵微波射頻集成電路芯片研發與製造的公司，在國內較早建成了商業化射頻集成電路芯片生產線，一直以來對技術與人才有較大的需求與依賴。汪耀祖等人的技術團隊主導了立昂東芯的整個產線建設、產品開發、客户認證、市場拓展，是立昂東芯的核心技術力量，也是未來發展不可缺少的主要技術支柱。
截至目前，汪耀祖率領的技術團隊已經為立昂東芯開發了6款高集成的銦鎵磷異質結雙極型晶體管(InGaP HBT)，7款亞微米至深亞微米砷化鎵贋高電子遷移率晶體管(GaAs pHEMT)射頻集成電路等生產工藝技術，主要應用於移動終端低噪放/功放芯片、基站功放/低噪放芯片、WiFi及微基站功放/低噪放芯片、基站數據回傳功放、毫米波移動端低噪放/功放芯片，以及車載雷達、衞星通訊等方面。由於技術已經相對成熟，開發與生產的器件在性能上與國外標杆公司相當，達到國際先進水平，其中多項工藝已經通過了國內主要設計公司的認證，基線工藝的穩定性和可靠性有充分的保障。立昂東芯擁有自主知識產權的砷化鎵半導體集成電路全套工藝製程技術所生產的產品已經通過多家客户認證，為下游兩個以上客户批量化採購應用，達到了商業化生產與銷售的目標。
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