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研究指美国制裁华为导致高通晶片於中国市场市占急跌
阿思达克 01-21 17:01
《CNBC》引述CINNO研究报道,去年中国智能手机单晶片系统(SOC)晶片需求共3.07亿块,按年跌20.8%,其中美国流动通讯晶片巨擘高通(Qualcomm)(QCOM.US)向中国交付量按年跌48%,在中国市场市占亦由37.9%跌至25.4%,失落中国市场领导地位,由台湾联发电(MediaTek)取代。

该研究指,中国电讯设备商华为被美国封杀,除影响高通向华为供货,亦导致OPPO、Vivo及小米(01810.HK)等其他手机制造商转向联发电,以规避美国制裁风险。当中小米近日已被美国列为与中国军方关联企业,面临美国封杀风险。华为的高端手机晶片在遭美国进一步封杀前亦转向台积电(TSMC)。

报告亦指,在中国推出5G通讯首年,中国智能手机单晶片系统晶片市场由海思半导体、联发电及高通竞争,而非4G年代高通独大的局面。

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