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華虹半導體(01347.HK):行業迎景氣長週期,12英寸擴產恰逢其時,給予“買入”評級,目標價 45.6 港元
格隆匯 12-02 12:19

機構:國元證券

評級:買入

目標價: 45.6 港元

投資要點

 公司專注於特色工藝晶圓代工

公司是全球領先的特色工藝純晶圓代工企業,特別專注於嵌入式非易失性存儲器、功率器件、仿真及電源管理和邏輯及射頻等差異化工藝平台,其卓越的質量管理體系亦滿足汽車電子芯片生產的嚴苛要求。公司於 2005 年成立,2014 年在香港主板上市。2019 年公司營業收入 9.46 億美元,位列全球晶圓代工廠第七位,市場佔有率 1.2%,同時是中國大陸第二大代工廠

全球半導體景氣度有望持續至 2023 年

國際半導體產業協會(SEMI)預測:2020 年全球半導體用硅晶圓總出貨面積將比上年增長 2.4%,達到 119.57 億平方英寸。推動晶圓出貨增長的主要動力是對雲服務、服務器、筆記本電腦、遊戲和醫療技術的需求不斷增長。5G、物聯網(IoT)、汽車、人工智能(AI)和機器學習等快速發展的技術繼續推動對更大連接性的需求,大型數據中心和大數據的需求也在增長。SEMI 預測 2021 年全球半導體用硅晶圓總出貨面積將超過歷史最高位,達到125.54 億平方英寸,並且此後仍將繼續增長至 2023 年。2021~2023 年市場規模的同比增速分別為 5%、5.3%和 4.1%。

公司產品結構升級與產能擴張並進,收入和毛利率將相應提升我們認為公司三座 8 英寸晶圓廠的產能將持續滿載,未來可通過對功率分立器件、嵌入式閃存 MCU、電源管理芯片及手機射頻 IC 的業務結構調整來提升收入和毛利率。無錫 12 英寸晶圓廠目前已經有包括 90 納米嵌入式閃存、65 納米邏輯與射頻工藝平台、分立器件三個平台進入量產階段,預計在 2020年底月產量有望達到 2 萬片。展望 2021 年,按照 IC+Power 的產品線佈局,該廠產能有望擴張到 4 萬片/月,產能有望在 2021 年 4 季度達到接近滿產。

 首次覆蓋給予“買入”評級,目標價 45.6 港元

我們預測公司 2020~2023 年收入分別為 9.5(+1.9%)、12.3(+29.8%)和 13.2(+7.4%)億美元,淨利潤 83.2(-48.7%)、111(+33.4%)和 135.1(+21.7%)百萬美元。我們認為公司產能擴張正逢行業長景氣週期,產能利用率迅速提升,資產盈利能力能夠充分得到運用,未來現金流將持續改善。公司經營穩健,具備持續盈利能力。參考行業估值,我們認為按 2.4 倍 PB2020E 是合理估值,給予“買入”評級,目標價 45.6 港元/股,按現價有 22%上升空間。

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