華虹半導體(01347.HK)公佈第三季度業績 收入升5.9%創歷史新高 預計四季度收入2.69億美元
格隆匯11月10日丨華虹半導體(01347.HK)公告，截至2020年9月30日止3個月，公司銷售收入創歷史新高，達2.530億美元，同比上升5.9%，環比上升12.3%；毛利率24.2%，同比下降6.8個百分點，環比下降1.8個百分點；母公司擁有人應占溢利1,770萬美元，上年同期為4,520萬美元，上季度為1,780萬美元。
本季度來自於8寸晶圓和12寸晶圓的銷售收入分別為2.364億美元及1,660萬美元。毛利率下降主要由於折舊費用及無錫新廠的固定成本上升。本季度資本開支4.036億美元，其中3.512億美元用於華虹無錫。
本季度末月產能達210,000片8寸等值晶圓。總體產能利用率為95.8%，環比上升2.4個百分點。本季度付運晶圓577,000片，同比增加10.1%，環比增加10.3%。
2020年第四季度指引：公司預計銷售收入約2.69億美元左右，預計毛利率約在21%至23%之間。
公司總裁兼執行董事唐均君先生對第三季度業績評論到:“公司對華虹半導體2020年第三季度的業績非常滿意。公司第三季度銷售收入創出新高，連續兩個季度實現環比雙位數增長。儘管全球新冠疫情還未得到完全控制，半導體產業景氣度已經逐步提升，尤其是國內消費回暖顯着，持續釋放終端需求。在MCU、IGBT以及邏輯芯片等產品的強烈需求推動下，公司取得了2.53億美元營收的歷史佳績。8寸產能利用率持續旺盛，三座8寸廠第三季度的產能利用率均超過100%；12寸產能利用率也大幅提升。受益於產能利用率的提升，毛利率也超過指引，公司實現連續39個季度盈利。”
“華虹無錫12寸新產品的導入按工藝開發計劃穩步推進，良率提升與產能爬坡速度均遠快於原計劃。目前，12寸嵌入式閃存、邏輯射頻與低壓功率器件三大平台持續量產出貨。第四季度還將有更多高壓功率器件IGBT和超級結等新產品陸續交付驗證。下階段的工作重點仍是加快無錫新廠產能建設，以緩解現有八寸產能受限的情況，並加速各工藝平台開發及完善，為更多客户提供更全面、更優質的產品解決方案。”
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