華虹半導體首季純利驟降57%，股價一度跌超5%
5月14日盤後，港股芯片核心股——華虹半導體（1347.HK）發佈2020年一季度“成績單”，總體低於市場預期。
受此影響，華虹半導體今日股價低開3%，並一路走低，一度跌超5%。截止發稿前，暫報15.84港元，跌幅4.06%最新市值為205億港元。
（來源：Wind）
據財報披露，一季度公司營收2.029億美元，同比下降8.1%；歸母淨利潤2031.4萬美元，同比下降57.2%。其中營收同比下滑，主要由於平均售價下降，環比下滑主要由於晶圓銷量下降及平均成本下降。
（來源：財報）
華虹半導體主要收入來源為半導體晶圓的直接銷售，一季度，晶圓銷售收入佔華虹半導體總營收比重達96.5%，付運晶圓46萬片，同比增長3.1%，環比下降9.1%，總體產能利用率為82.4%，同比下降4.9個百分點，環比下降5.6個百分點。
分區域看，中國區營收1.245億美元，佔比營收的52.8%，同比增長6.8%。另外，美國營收2536.3萬美元，佔比18.6%，同比大幅下滑38.3%，主要由於通用MOSFET、超級結、邏輯及MCU產品的需求減少。日本銷售收入740萬美元，主要由於通用MOSFET、超級結、邏輯及MCU產品的需求減少。
（來源：財報）
一季度公司綜合毛利率為21.1%，同比大幅下滑11.1%,環比下滑6.1%。綜合淨利率為1.4%，同比大幅下滑19.7%，環比下滑4.4%。毛利率下滑主要由於平均售價下降，折舊費用上升及產品組合變化；環比下降6.1個百分點，主要由於平均售價下降及產品組合變化。
展望下季度，華虹半導體提供的業績指引顯示，預計第二季度營收約2.2億美元，同比2019年第二季度（2.3億美元）略有下滑，預計毛利率約在22%至24%之間，同比2019年第二季度下滑7-9個百分點。
公司總裁兼執行董事唐均君稱：“受海外疫情影響，參與設備調試的廠商技術人員到崗有所推遲，我們與廠商正協力推進設備的調試工作，相信隨着疫情的好轉，第二階段的工藝設備調試將盡快完成。另外，基於12英寸生產線90nm、65nm研發項目達成了預期目標。”
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