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聖邦股份(300661.SZ)2019年度歸母淨利潤升69.76%至1.76億元 擬10轉5派5元
格隆匯 03-30 21:16

格隆匯3月30日丨聖邦股份(300661.SZ)披露2019年年度報告,實現營業收入7.92億元,同比增長38.45%;歸屬於母公司股東的淨利潤1.76億元,同比增長69.76%;歸屬於上市公司股東的扣除非經常性損益的淨利潤1.60億元,同比增長76.01%;基本每股收益1.7022元,擬每10股派發現金紅利5元(含税),以資本公積金向全體股東每10股轉增5股。

公司是一家專注於高性能、高品質模擬集成電路芯片設計及銷售的高新技術企業。目前擁有16大類1,400餘款在銷售產品,涵蓋信號鏈和電源管理兩大領域,包括運算放大器、比較器、音/視頻放大器、模擬開關、電平轉換及接口電路、數據轉換芯片、小邏輯芯片、LDO、DC/DC轉換器、OVP、負載開關、LED驅動器、微處理器電源監控電路、馬達驅動及電池管理芯片等。公司產品可廣泛應用於消費類電子、通訊設備、工業控制、醫療儀器、汽車電子等領域,以及物聯網、新能源、可穿戴設備、人工智能、智能家居、智能製造、5G通訊等新興電子產品領域。

公司的主營業務為模擬芯片的研發與銷售,屬於半導體集成電路產業中的集成電路設計行業。集成電路產業經過幾十年的發展逐步形成了設計業、製造業、封裝測試業三個細分行業。集成電路設計企業由於更接近和了解市場,通過不斷創新開發出高附加值的產品,直接推動着電子設備的更新換代;同時,在創新中獲取利潤,在快速發展的基礎上積累資本並作出新投入,為整個集成電路產業的增長注入了新活力,並帶動了整個半導體產業的發展。由此,集成電路設計行業成為了集成電路產業的“龍頭”。集成電路設計行業具有較穩定的增長能力和較強的抗週期能力。作為上游產業的集成電路製造業(晶圓代工業)及封裝測試業則在良率、成本、產能和交期等方面對集成電路設計業產生影響。

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