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高通发布多款Wi-Fi 6芯片,5G和Wi-Fi将合二为一
格隆汇 08-29 12:59

来源:腾讯科技

高通开始在芯片领域进行多元化,周二发布了一系列新的Wi-Fi通信芯片,这些芯片与最新版本的Wi-Fi 6通信技术标准兼容。

美国高通公司是全世界最大的手机芯片制造商,同时也是名列前茅的电信专利持有人,这些市场主导优势也给高通带来了大量的反垄断调查麻烦。

据外媒最新消息,高通开始在芯片领域进行多元化,周二发布了一系列新的Wi-Fi通信芯片,这些芯片与最新版本的Wi-Fi 6通信技术标准兼容。高通希望这些芯片将有助于提高其5G通信芯片的销量。另外,Wi-Fi和5G通信未来将走向融合,不再是相互分割的通信技术。

据国外媒体报道,在手机芯片(包括调制解调器,以及整合了调制解调器和应用处理器的系统芯片)领域,高通一直排名行业第一,但随着全球手机市场近年来陷入停滞,该公司一直在寻求扩大其他类别的通信芯片业务。

这家总部位于美国圣地亚哥的科技公司一直在进军汽车、耳机、笔记本电脑和其他设备的芯片领域。它过去推出的的的Wi-Fi芯片可以在诸如谷歌公司生产的网状Wi-Fi路由器等设备中找到,这种路由器的设计初衷是为整个家庭提供更好的网络覆盖。

此外,高通还与三星电子等智能手机制造商合作,将下一代无线数据网络5G芯片引入手机。

高通希望,随着新一代Wi-Fi芯片的推出,它的两条芯片业务线有一天能走到一起。

据悉,Wi-Fi 6新标准将在2022年全面铺开后。另外Wi-Fi 6和5G通信技术一样和过去的版本有很大不同,能够让通信设备更紧密地合作,比如智能手机能够更容易的在移动通信基站和Wi-Fi路由器之间切换通信(如今用户需要单独启动手机中的Wi-Fi网络连接)。

此外,与之前主要由电信公司拥有网络的4G技术不同,5G技术将允许企业建立自己私有的5G网络,这样可以更好地连接大型校园、工厂和其他难以覆盖Wi-Fi的地点。

高通总裁兼芯片部门主管克里斯蒂亚诺·阿蒙(Cristiano Amon)表示,该公司希望有一天能将整合这两种技术的芯片卖给商业网络设备制造商。

阿蒙在接受外媒采访时表示:“你应该期待未来我们会讨论集成(5G)毫米波和Wi-Fi 6的平台。”

值得一提的是,高通最近在反垄断方面获得一个小小的胜利。过去美国政府向法院起诉高通在专利授权领域实施垄断行为,法庭在判决书中要求高通和专利授权客户重新签署授权协议,但是最近,美国一家上诉法庭批准高通在上诉期间,可以暂不执行反垄断判决书,这免去了重新签署授权协议的巨大麻烦。外媒称,如果这一判决书内容得到贯彻实施,全球手机通信芯片的价格将会下降,智能手机的专利费和整体成本也会明显下降。

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