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泰凌微(688591.SH):端側AI新品的推廣取得階段性成果

格隆匯6月23日丨泰凌微(688591.SH)公佈,隨着客戶對芯片端側AI集成能力需求的不斷增長,公司積極投入研發,2024年底成功推出了新一代的同時支持端側AI和多項物聯網無線連接技術的芯片產品,產品推出後憑藉卓越性能與創新特性,迅速贏得了客戶的青睞,並進入規模量產階段,2025年二季度新產品的銷售額已經達到人民幣千萬元規模,端側AI新品的推廣取得階段性成果。

針對客戶對於芯片端側AI能力集成需求的快速增長,以及AIOT產品多元化的發展趨勢,公司戰略性地佈局了不同系列的芯片產品線並配套了相對應的模塊。新產品集成了先進的端側AI運算能力,支持多種物聯網無線連接協議。TL721X系列以其1mA超低功耗,成爲業界領先的低功耗端側AI多協議物聯網無線SoC芯片,滿足了新一代智能物聯網終端產品對超低功耗的AI算力和多種無線連接的高標準要求。TL751X系列則通過其高性能、多協議和高集成度,結合先進的多核設計包括CPU、NPU和DSP,提供了強大的AI運算處理能力和幾乎所有主流物聯網無線連接協議(BLE、Zigbee、Thread、Matter等)的支持,適用於各種智能無線物聯網和無線音頻SoC等領域。

上述兩款TL7系列芯片是國內最早通過最新的BLE6.0藍牙協議認證的芯片產品。公司同時提供面向廣大開發者的基於這兩款芯片的TL-EdgeAI開發平臺,支持包括谷歌LiteRT、TVM、PyTorch等在內的主流端側AI模型,客戶只需幾個小時就可以把訓練好的AI模型植入公司芯片內並且實現所需的AI功能。這是全球行業內功耗最低的智能物聯網連接協議平臺之一,特別適合各類電池供電的智能產品,爲AI端側應用的發展提供巨大助力,使藍牙等物聯網無線連接芯片脫離了傳統無線通訊芯片的單一傳輸功能,實現了可自行學習,可參與、對接大模型和應用小模型。公司近期還將推出以TL721X爲基礎的認證模塊,進一步幫助客戶縮短開發時程,加速產品上市時間(Time-to-Market)。

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