芯原股份(688521.SH):目前公司Chiplet業務進展順利
格隆匯2月13日丨芯原股份(688521.SH)接受特定對象調研時表示,隨着各行各業進入人工智能升級的關鍵時期,市場對於大算力的需求急劇增長。在此背景下,集成電路行業正經歷從 SoC(系統級芯片)向 SiP(系統級封裝)的轉型,這一轉變是出於對高性能單芯片集成度與複雜性的提升、性能與功耗的優化、良率與設計/製造成本改善等多方面的考量。爲了適應這一發展趨勢,芯原正在將其在SoC中扮演重要角色的半導體IP(知識產權)升級爲SiP中的核心組件——Chiplet,並基於此構建Chiplet架構的芯片設計服務平臺。
目前,公司Chiplet業務進展順利,芯原已幫助客戶設計了基於Chiplet架構的高端應用處理器,採用了MCM先進封裝技術,將高性能SoC和多顆IPM內存合封;已幫助客戶的高算力AIGC芯片設計了2.5DCoWos封裝;已設計研發了針對Die to Die連接的UCIe/BoW兼容的物理層接口;已和Chiplet芯片解決方案的行業領導者藍洋智能合作,爲其提供包括GPGPU、NPU和VPU在內的多款芯原自有處理器IP,幫助其部署基於Chiplet架構的高性能人工智能芯片,該芯片面向數據中心、高性能計算、汽車等應用領域。
公司再融資募投項目之一爲“AIGC及智慧出行領域Chiplet解決方案平臺研發項目",並形成基於Chiplet架構的軟硬件芯片設計平臺,對公司現有技術有如下提升:1)結合公司IP技術、芯片軟硬件設計能力等,新增高算力GPGPU Chiplet、AI Chiplet和主控Chiplet;2)新增Die to Die接口IP及相關軟件協議棧;3)強化先進封裝技術的設計與應用能力;4)開發基於Chiplet架構的可擴展大算力軟硬件架構。
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