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增持中環!佈局多晶硅!TCL科技(000100.SZ)光伏和半導體版圖再擴張

4月19日,TCL科技(000100.SZ)發佈公吿稱,公司與協鑫集團等有關方簽署《合作框架協議書》,將在呼和浩特市投資120億元新建光伏級和電子級硅料相關項目。

根據協議內容,項目包括約10萬噸光伏級多晶硅、硅基材料綜合利用的生產及下游應用領域研發項目,總投資預計為90億元,以及約1萬噸電子級多晶硅項目,總投資預計為30億元,TCL科技、保利協鑫關聯方在合資公司中的股權比例擬定為40%、60%。

TCL科技表示,通過本項目的建設,公司將實現在半導體光伏及半導體材料上游核心多晶硅材料的業務佈局,有利於實現產業鏈戰略協同降本,強化供應鏈穩定性,助力實現公司“半導體光伏材料全球領先戰略,半導體材料追趕超越戰略”。

同一天,TCL科技旗下的中環股份(002129.SZ)發佈公吿顯示,自2022年1月11日至今,公司第一大股東累計增持48,787,856股,累計增持比例為1.51%。目前,中環股份在半導體光伏和半導體材料領域的產業賽道已建立相對競爭優勢, 2019年,中環半導體在全球率先推出210mm大尺寸光伏單晶硅片G12,技術路線得到市場認可,同時憑藉業內領先的工業4.0及柔性製造水平,技術實力和產業鏈生態優勢位進一步拉昇,210mm大尺寸市場份額全球第一,已成為光伏硅片龍頭。另外,8-12英寸半導體硅片亦處於國內領先。

TCL科技一方面屢次增持中環股份,看好中環的長期發展,另一方面開始圍繞光伏和半導體往上游的多晶硅材料進軍,完善產業鏈一體化優勢,其光伏和半導體版圖擴張值得期待。

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