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晶方科技(603005.SH):擬參與共建車規半導體產業技術研究所
格隆匯 12-17 17:56

格隆匯12月17日丨晶方科技(603005.SH)公佈,為把握汽車產業智能化,電動化和網聯化帶來的新機遇,通過引入、孵化與培育研發團隊,致力於車規半導體新工藝、新材料、新設備的研發與戰略佈局,充分發揮蘇州園區、蘇州產研院等共建方的資源與品牌優勢,聚焦車電半導體創新需求,逐步構建產業生態鏈,公司擬與蘇州市產業技術研究院(“產研院”)、蘇州工業園區管理委員會(“園區管委會”)、“車規半導體產業化技術研究所”團隊(“研究所團隊”)共建“蘇州市產業技術研究院車規半導體產業技術研究所”(“研究所”),研究所註冊資本1000萬元人民幣,建設週期五年。

研究所註冊資金擬為1000萬元人民幣,由公司、蘇州思萃創業投資有限公司(“思萃創業”,代表產研院)、蘇州工業園區領軍創業投資有限公司(“領軍創投”,代表園區管委會)、研究所團隊共同出資設立,其中公司認繳出資人民幣300萬元,佔註冊資本比例為30%,思萃創業認繳出資150萬元,佔註冊資本比例為15%,領軍創投認繳出資150萬元,佔註冊資本比例為15%,研究所團隊認繳出資400萬元,佔註冊資本比例為40%,研究所團隊由公司董事長、總經理王蔚牽頭組建,並由王蔚兼任研究所所長職務。

參與研究所的共建,充分利用政府、產研院等共建方的資源支持通過引入、孵化與培育研發團隊,對車規半導體新工藝、新材料、新設備展開研發與戰略佈局,以車電半導體需求為聚焦點構建產業生態鏈,有利公司更好把握汽車產業智能化,電動化和網聯化帶來的新發展機遇

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