露笑科技(002617.SZ):擬向合資公司增資1500萬元 夯實碳化硅半導體業務板塊產業佈局
格隆匯6月25日丨露笑科技(002617.SZ)公吿,公司於2020年10月16日與合肥北城資本管理有限公司(“合肥北城”)、長豐四面體新材料科技中心(有限合夥)(“長豐四面體”)簽署了《合資協議》,協議約定三方合作在安徽省合肥市長豐縣投資建設“第三代功率半導體(碳化硅)產業園項目”(簡稱“項目”),並共同出資設立一家有限責任公司作為該項目的項目公司。
據悉,合資公司名稱為“合肥露笑半導體材料有限公司”(“合肥露笑半導體”),註冊資本2億元人民幣,該部分資金將主要用於碳化硅廠房的初步建設,公司佔47.5%,合肥北城佔47.5%,長豐四面體佔5%,合資公司為公司的參股公司。
公司於2021年6月25日與合肥北城、長豐四面體、合肥長豐產業投促創業投資基金合夥企業(有限合夥)(“投促基金”)、合肥露笑半導體簽署了《合肥露笑半導體材料有限公司增資協議》,協議約定對合肥露笑半導體增加1.1億元註冊資本,投促基金擬認繳目標公司新增註冊資本9500萬元,露笑科技擬認繳目標公司新增註冊資本1500萬元。
此次增資是為了依託四方資金、技術、管理模式、市場等資源,充分發揮各方優勢,夯實碳化硅半導體業務板塊產業佈局,公司將根據項目的進展情況繼續追加投資,推動公司轉型及持續穩定發展。
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