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景旺電子(603228.SH)擬投資26.89億元建設年產60萬平方米高密度互連印刷電路板項目
格隆匯 12-12 20:38

格隆匯12月12日丨景旺電子(603228.SH)公佈,為提升公司高端PCB的製造技術和能力,滿足國際領先品牌客户對高端高質PCB的需求,提升公司的綜合核心競爭實力,提升公司在技術、研發、產品等方面的優勢,公司擬投資建設“景旺電子科技(珠海)有限公司一期工程——年產60萬平方米高密度互連印刷電路板項目”(以下簡稱“HDI項目”)。項目預計投資總額為26.89億元,項目資金來源為自籌。

建設內容包括新建廠房、宿舍、研發大樓及相關生產製造配套設施等。通過項目建設,新建高端HDI(含mSAP技術)生產線,形成60萬平方米的高密度互連印刷電路板生產能力。項目建成達產後,預計可實現不含税年銷售收入27.72億元,年税前利潤總額5.25億元,項目投資回收期8.61年(税後)。

項目建成後,可以使公司快速進入批量高端HDI領域,在增加公司營收規模的同時可提高公司高附加值產品的比重、豐富公司產品的種類、進一步夯實公司的技術能力,滿足客户更多高端HDI產品需求,一站式滿足客户多樣化產品需求,提高客户粘性,提升公司品牌力和核心競爭力。

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