大港股份(002077.SZ)子公司CIS芯片晶圓級封裝產能擴充
格隆匯12月11日丨大港股份(002077.SZ)公佈,公司於2019年12月11日召開了第七屆董事會第十四次會議,審議通過了《關於子公司CIS芯片晶圓級封裝產能擴充的議案》,公司子公司蘇州科陽光電科技有限公司(“蘇州科陽”)擬使用自籌資金在原有產線上增加設備的方式擴充8吋CIS芯片晶圓級封裝產能,預計總投資1.3億元,產能擴充分兩期實施,其中首期新增產能3000片/月。
此次擴產是在原有月產能12000片的基礎上,通過增加設備的方式,主要建設8吋CIS芯片晶圓級封裝產能,分兩期實施,預計總投資1.3億元,其中首期投資7000萬元,擴建8吋CIS芯片晶圓級封裝產能3000片/月,擴建完成後8吋CIS芯片晶圓級封裝產能增加至15000片/月。二期投資6000萬元,產能擴建主要用於CIS芯片和濾波器芯片封裝等。
此次擴產是為了滿足8吋CIS芯片劇增的市場需求,搶抓8吋CIS芯片晶圓級封裝發展契機,提升蘇州科陽產品市場份額和規模效益,進一步優化公司集成電路產業結構和佈局。
蘇州科陽是公司集成電路封裝業務運作平台,擴充8吋CIS芯片晶圓級封裝產能有利於進一步提升蘇州科陽產品市場份額、行業地位和競爭優勢,有利於進一步優化公司集成電路產業佈局,符合公司聚焦發展先進封裝和高端測試的集成電路產業發展戰略。
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