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炬光科技(688167.SH):LAB設備通過激光局部加熱技術,可實現高精度、低熱應力的鍵合效果
格隆匯 07-04 15:52

格隆匯7月4日丨炬光科技(688167.SH)在互動平台表示,激光輔助鍵合(Laser Assisted Bonding,簡稱LAB),是一種先進的微連接技術,它利用激光的高能量密度特性,將激光束聚焦照射在需要鍵合的材料界面處,使材料表面瞬間升温,達到特定的温度條件,引發材料間的物理或化學變化,從而實現鍵合材料的牢固連接。2024年8月28日,炬光科技正式發佈應用於芯片先進封裝工藝的Flux H系列高精度可變光斑激光系統。公司的激光輔助鍵合(LAB)設備主要應用於半導體先進封裝領域,尤其適用於對鍵合精度、熱影響控制及材料兼容性要求較高的場景,例如芯片級封裝(CSP)、三維集成(3D IC)及微機電系統(MEMS)製造中的低温鍵合需求。 針對HBM(高帶寬內存)芯片製造,其核心工藝涉及多層DRAM芯片的垂直堆疊與高密度互連,對鍵合技術的精度(如微米級對齊)、可靠性(如低温/無應力鍵合)及效率(如高速工藝適配)有嚴格要求。LAB設備通過激光局部加熱技術,可實現高精度、低熱應力的鍵合效果,理論上適配HBM製造中銅-銅或混合鍵合等關鍵工藝需求。

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