博敏電子(603936.SH):HBM產品作爲公司IC載板業務未來主要發展方向之一,目前在持續關注並規劃中
格隆匯6月27日丨博敏電子(603936.SH)在投資者互動平臺表示,HBM是一種高帶寬內存器,在人工智能大模型高算力需求的推動下,逐漸成爲存儲廠商佈局的重點。公司當前存儲類IC載板產品主要來源於江蘇博敏二期設立的IC封裝載板產品線,達產後產能約1萬平米/月,該產品線涵蓋Memory、RF、WB-BOC、PBGA、WBCSP、FCCSP等,產品主要應用於數據存儲、微機電控制、光電顯示和無線射頻等領域。HBM產品作爲公司IC載板業務未來主要發展方向之一,目前在持續關注並規劃中,相關可研設計也在逐步推進中,後續業務進展請您留意公司相關公告。
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