精智達(688627.SH):配合客戶業務穩步推進開發針對如KGSD、HBM等基於2.5D和3D新一代半導體封裝技術的測試技術和設備
格隆匯6月11日丨精智達(688627.SH)在互動平臺表示,公司根據新技術和新應用在半導體存儲器和AI算力芯片方面的新要求,配合客戶業務穩步推進開發針對如KGSD、HBM等基於2.5D和3D新一代半導體封裝技術的測試技術和設備,並在分選機、探針臺等測試設備方面進行研發佈局。公司已基本實現半導體存儲器件測試設備主要產品的全面佈局,能夠爲客戶提供系統化解決方案。目前公司的DRAM老化測試修復設備、MEMS探針卡等產品出貨量持續提升,保持國產設備供應商中的領先地位;具備晶圓裸片測試功能、旨在提升客戶研發設計和品質驗證效率的存儲器通用測試驗證機獲得批量訂單並且實現驗收,自主研發測試機平臺已經獲得客戶認可;持續推動滿足針對先進封裝測試要求的升級版CP測試機、高速FT測試機等核心測試設備研發及客戶驗證工作;高速FT測試機專用ASIC芯片(最高可實現9Gbps信號輸出與校準)已獲得客戶認可,標誌着公司在高速芯片測試領域取得重要突破。HBM業務仍處前期發展階段,客戶項目推進及設備驗證、量產存在不確定性,敬請廣大投資者關注公司公告並注意投資風險。
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