德邦科技(688035.SH):泰吉諾供貨宇樹科技的熱界面材料主要應用於CPU芯片散熱
格隆匯3月24日丨德邦科技(688035.SH)在投資者互動平台表示,泰吉諾超薄導熱界面材料Fill-TPM 800應用於大算力芯片,該產品技術壁壘在於如何使TIM1.5材料在滿足高算力芯片對高導熱、低BLT、低熱阻的熱性能要求下,同時平衡實現更高應用可靠性,即更加優異的抗pump out性能。泰吉諾針對算力服務器的導熱已經形成較為系統的解決方案,包括TIM1.5和板級墊片等,在解決散熱的同時兼顧可靠性、力學、施工便捷性及滲油控制等問題。泰吉諾供貨宇樹科技的熱界面材料主要應用於CPU芯片散熱,目前人形機器人領域仍處於發展的初期階段,該業務佔公司整體收入比例很低,短期內對公司整體業績影響還很小。
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