ASMPT(00522.HK)：第三季度經調整盈利為港幣2950萬元
格隆匯10月30日丨ASMPT(00522.HK)發佈公吿，2024年第三季度，銷售收入為4.29億美元，按季持平，按年則下跌3.7%。半導體解決方案分部銷售收入錄得增長，而表面貼裝技術解決方案分部的銷售收入則下降。在半導體解決方案分部的推動之下，新增訂單總額為4.06億美元，按季增長1.5%及按年增長7.1%，但部分被表面貼裝技術解決方案分部的疲軟所抵消。集團的經調整盈利為港幣2950萬元，按季及按年下降，主要受外幣匯兑影響所致。撇除該影響，經調整盈利按季應為持平及按年則上升73%。
集團於季末的未完成訂單總額約為8.06億美元，訂單對付運比率為0.95。集團的流動資金狀況維持穩健，截至2024年9月30日，集團的現金及銀行存款總合共港幣54.7億元，而銀行借款則為港幣25.8億元。集團預期2024年第四季度的銷售收入將介乎於3.8億美元至4.6億美元之間，以中位數計按年下降3.5%，按季亦下降2.0%。
2024年第三季度，整體半導體行業的復甦步伐仍然各異。一方面，包括消費者、電腦及通訊終端市場應用的週期性半導體需求(非人工智能相關)的復甦步伐較預期緩慢。此外，汽車及工業終端市場仍然疲弱。這些趨勢繼續影響集團半導體解決方案分部的主流業務及表面貼裝技術解決方案分部的業務。
半導體解決方案分部的主流業務於本季度的新增訂單總額按季錄得增長。然而，有關業務訂單仍然較零散，其銷量不足以反映市場廣泛地復甦。表面貼裝技術解決方案分部的整體市場仍持續疲弱，且新增訂單總額處於較低水平，儘管如此，今年該分部依然保持市場領先地位。
另一方面，對生成式人工智能的需求上升，推動來自主要人工智能參與者的大量資本性支出。人工智能的加速採用繼續推動對先進邏輯及記憶體封裝應用的需求。集團的先進封裝(“AP”)解決方案繼續因此而受惠，其新增訂單總額於本季度保持強勁，這主要受惠於熱壓焊接(“TCB”)及光子解決方案所支持。集團獨特及廣泛的產品組合繼續是其重要的優勢。由於集團業務遵循不同的週期，先進封裝的勢頭緩減了部分主流業務疲弱的影響。
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