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三超新材(300554.SZ):在半導體領域的產品包括半導體裝備和半導體耗材
格隆匯 07-08 15:53

格隆匯7月8日丨三超新材(300554.SZ)在投資者互動平台表示,公司在半導體領域的產品包括半導體裝備和半導體耗材。半導體裝備包括已推出的硅棒磨倒加工一體機,和正在研發的晶圓背面減薄機、倒角機、邊拋機等;半導體耗材為半導體芯片製造過程中用到的減薄砂輪、樹脂軟刀、金屬軟刀、電鍍軟刀、硬刀(劃片刀)、倒角砂輪和CMP-Disk,以及硬刀劃片液、激光切割保護液等。

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