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深南電路(002916.SZ):一季度公司封裝基板業務需求整體延續去年第四季度態勢
格隆匯 05-09 09:28

格隆匯5月9日丨深南電路(002916.SZ)在券商策略會上表示,2024 年一季度,公司封裝基板業務需求整體延續去年第四季度態勢。BT 類封裝基板保持穩定批量生產,FC-BGA 封裝基板各階產品對應的產線驗證導入、送樣認證等工作有序推進。

其進一步表示,公司生產的封裝基板產品覆蓋種類廣泛多樣,包括模組類封裝基板、存儲類封裝基板、應用處理器芯片封裝基板等,主要應用於移動智能終端、服務器/存儲等領域。公司目前已形成具有自主知識產權的封裝基板生產技術和工藝,建立了適應集成電路領域的運營體系,具備了包括 WB、FC 封裝形式全覆蓋的 BT 類封裝基板量產能力,並持續推進 FC-BGA 產品在廣州封裝基板項目的平台能力建設。

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