深南電路(002916.SZ):廣州封裝基板項目一期建設推進順利 目前已開始產能爬坡
格隆匯3月18日丨深南電路(002916.SZ)近日在接待機構投資者調研時表示,公司封裝基板業務產品覆蓋種類廣泛多樣,包括模組類封裝基板、存儲類封裝基板、應用處理器芯片封裝基板等,主要應用於移動智能終端、服務器/存儲等領域。2023年上半年全球半導體行業景氣較弱,下游客户產品庫存調整週期拉長,下半年以來部分領域需求有所修復。公司封裝基板業務通過深耕存量市場、開發新客户等多措並舉,保障業務營收的基本穩定。公司憑藉廣泛的BT類基板產品覆蓋能力與針對性的銷售策略把握需求回暖機遇,其中存儲與射頻產品受益於客户開發突破與下半年存量客户需求修復,均實現了訂單同比增長。FC-BGA封裝基板部分產品已完成送樣認證,處於產線驗證導入階段。
另一方面,無錫二期基板工廠持續推進能力提升與量產爬坡,加速客户認證和產品導入進程。廣州封裝基板項目一期建設推進順利,已於2023年第四季度完成連線投產,目前已開始產能爬坡。無錫二期基板工廠爬坡和廣州封裝基板項目建設帶來的成本和費用增加對公司報吿期內利潤造成一定負向影響。公司將繼續推進封裝基板業務戰略目標客户開發與關鍵項目落地,推動無錫二期基板工廠實現盈利、加快FC-BGA產品線競爭力建設,支撐廣州封裝基板項目順利爬坡。
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