耐科裝備(688419.SH):涉及半導體相關的產品主要為全自動封裝設備,應用於半導體制造後道工序塑封工藝
格隆匯9月19日丨耐科裝備(688419.SH)在投資者互動平台表示,本公司涉及半導體相關的產品主要為全自動封裝設備,應用於半導體制造後道工序塑封工藝。塑封的主要作用是保護芯片、支撐芯片、將芯片電極與外界電路連通及保證芯片的可靠性等。目前IC芯片無法脱離封裝在使用中有效發揮功能,封裝可對脆弱、敏感的IC芯片加以保護。目前國內半導體塑封設備成型採用轉註成型工藝,用於晶圓級、板級封裝的壓塑成型工藝裝備技術仍然被國外少數企業壟斷,本公司相關設備研發正在進行中。
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