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通富微電(002156.SZ):現已具備7nm、Chiplet先進封裝技術規模量產能力
格隆匯 06-27 13:48

格隆匯6月27日丨有投資者向通富微電(002156.SZ)提問,“咱們公司具備COWOS技術嗎”

通富微電回覆稱,公司在發展過程中不斷加強自主創新,並在多個先進封裝技術領域積極開展國內外專利佈局。截至2022年12月31日,公司累計國內外專利申請達1,383件,其中發明專利佔比約70%;同時,公司先後從富士通、卡西歐、AMD獲得技術許可,使公司快速切入高端封測領域,為公司進一步向高階封測邁進,奠定堅實的技術基礎。公司在Chiplet、WLP、SiP、Fanout、2.5D、3D堆疊等先進封裝方面均有佈局和儲備。公司通過在多芯片組件、集成扇出封裝、2.5D/3D等先進封裝技術方面的提前佈局,可為客户提供多樣化的Chiplet封裝解決方案,現已具備7nm、Chiplet先進封裝技術規模量產能力。

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