賽微電子(300456.SZ)：公司沒有生產FPGA芯片
格隆匯5月18日丨有投資者在投資者互動平台向賽微電子(300456.SZ)提問，“請問貴公司有生產FPGA芯片嗎 或者有沒有相關生產技術 請問MEMS技術與CMOS技術有什麼聯繫”
賽微電子回覆稱，公司沒有生產FPGA（Field-Programmable Gate Array，即現場可編程邏輯門陣列）芯片。1、CMOS的全稱是Complementary Metal-Oxide Semiconductor，也被稱為互補金屬氧化物半導體，一般指製造大規模集成電路（IC）芯片用的一種技術或用這種技術製造出來的芯片，具有功耗低、速度快、抗干擾能力強、集成度高等眾多優點。2、MEMS的全稱是Micro Electronic Mechanical System，即微電子機械系統，簡稱為微機電系統，是指由基於 Micro-machining 技術製造的微傳感芯片（或微執行芯片），和控制/處理芯片（ASIC）組成的微型電子機械系統，MEMS 能夠將信息的獲取、處理和執行集成在一起，是一種將微電子技術與微機械工程融合到一起、具有多功能的工業技術及相應的集成系統。MEMS 能夠大幅度地提高系統的自動化、智能化水平。3、關於MEMS技術與CMOS技術的聯繫，一般認為，MEMS工藝技術來源於CMOS工藝技術，可以看作是CMOS集成電路的一種擴展。CMOS往往負責運算和存儲，MEMS往往負責感知與執行，如果將CMOS比喻為人體的大腦和神經網絡，那麼MEMS就是人體的耳、目、鼻、舌、膚等感知器官和手臂、足膝等執行器官。與CMOS芯片相比，MEMS芯片需要結合力學、化學、光學等學科知識和技術，需要使用更為複雜與多樣化的材料、結構與集成工藝，因此發展成為集成電路的一個新的分支。當然，隨着分離器件向集成電路轉變的行業趨勢變動，帶動了MEMS與CMOS工藝技術的結合兼容需求，希望能夠基於標準化的CMOS工藝，實現MEMS芯片的高度集成化，實現傳感器件、信號採集、數據處理、控制電路、執行器件在三維硅片上的混合集成、智能化集成，成為CMOS-MEMS集成芯片。
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