中華銀科技(00515.HK)訂立兩份項目協議
格隆匯1月17日丨中華銀科技(00515.HK)公吿，於2023年1月9日，中山達進(公司的間接全資附屬公司)與中國廣東省中山市三角鎮人民政府就該等項目(即集團可能於該等發展地塊投資第三期發展項目)訂立兩份項目協議。
項目A名為達進電路板環保共性產業園A園區，涉及集團可能進行投資，以於發展地塊A興建新廠房及配套物業(集團內部命名為第3A期發展項目），總建築面積約為151,875.44平方米。為加強工業發展的可持續性及優異質量，該項目不允許進行相關工業指引淘汰及禁止類別的生產活動。
發展地塊A為目前用作集團生產廠房的工業用途地塊，位於中國廣東省中山市三角鎮高平大道98號，總地塊面積為65,999.7平方米。
項目B名為達進電路板環保共性產業園B園區，涉及集團可能進行投資，以於發展地塊B興建新廠房及配套物業(集團內部命名為第3B期發展項目)，總建築面積約為248,333.45平方米。為加強工業發展的可持續性及優異質量，該項目不允許進行相關工業指引淘汰及禁止類別的生產活動。
發展地塊B為目前用作集團生產廠房的工業用途地塊，位於中國廣東省中山市三角鎮高平大道91號，總地塊面積為66,666.7平方米。於發展地塊B興建樓宇原先獲准的最高地積比率為1.0至1.5倍。目前及於重新開發前，位於發展地塊B的廠房及配套物業的總建築面積為58,015平方米。根據項目協議，發展地塊B的地積比率將會增至3.5倍。
建設新一期的生產設施，可令集團做好更充分的準備，開啟下一發展階段，令公司的生產設施與公司的企業戰略保持一致，以專注於利潤率更高、競爭力更強及可持續性更好的高端產品及高附加值工藝。透過簽署該等項目協議，集團已為其長期未來擴展妥為做好準備，同時保持建築圖則設計及提交時間的靈活性，以滿足公司自身的營運需求。
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