華虹半導體(01347.HK)與大基金等向華虹無錫注資8億美元 繼續擴大12英寸晶圓生產線產能
格隆匯6月29日丨華虹半導體(01347.HK)宣佈，於2022年6月29日，公司、華虹宏力、無錫實體、國家集成電路產業基金、國家集成電路產業基金II及華虹無錫訂立注資協議，據此，董事會已有條件同意華虹無錫的註冊資本將自18億美元增至約25.3685億美元，其中公司、華虹宏力、無錫實體及國家集成電路產業基金II各自分別以現金方式出資約1.7778億美元、2.3022億美元、1.60億美元及2.32億美元作為對華虹無錫的注資。於注資完成後，華虹無錫將繼續為公司一家非全資子公司，由公司持有約22.2%及由華虹宏力持有約28.8%。
據悉，華虹無錫為一家於2017年10月10日在中國註冊成立的公司，為公司一家非全資子公司，主要從事12英寸(300mm)晶圓集成電路的設計、研究、製造、測試、封裝及銷售業務。
公吿稱，華虹無錫12英寸(300mm)晶圓廠於2022年步入其投產的第四年。儘管華虹無錫持續進行產能擴充，但由於市場發展帶來的晶圓需求持續強勁，目前產能仍然供不應求。華虹無錫的產能利用率保持在一個非常高的水平。於2020年及2021年財政年度，華虹無錫已完成公司技術開發、產能擴充及產品交付的所有內部業務目標。
此外，預計全球半導體及芯片供需不平衡將持續到2022年以後，特別是公司專注的行業之一汽車領域。華虹無錫於2020年獲得IATF16949汽車質量管理體系認證並自2021年起將汽車產品導入其12英寸晶圓廠。加上擬注資，華虹無錫的專業技術將使公司能夠進一步滿足汽車市場需求。公司期盼抓住並利用這一具有吸引力且重大的市場機遇，以確保華虹無錫有足夠的營運資金來擴大其12英寸(300mm)晶圓的產能。
鑑於華虹無錫的強勁表現及公司"8英寸+12英寸"的企業戰略，公司於2022年將繼續擴大其12英寸晶圓生產線的產能。注資符合公司的策略，以加強其在8英寸(200mm)及12英寸(300mm)晶圓代工行業特色工藝的領先市場地位及競爭力。
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