鼎龍股份(300054.SZ)：擬投資新建鼎龍仙桃光電半導體材料產業園
格隆匯4月14日丨 鼎龍股份(300054.SZ)公佈，根據公司發展規劃，為抓住泛半導體材料的市場機遇，豐富公司現有產品及完善產業佈局，進一步提升公司在泛半導體核心進口替代類工藝材料產業中綜合競爭實力，保證充足的產能並更好服務國內芯片製程客户及柔性顯示面板客户需求，公司擬與湖北省仙桃市高新技術產業園簽署相關合作協議，擬同意公司(暫定主體，後期可能依項目實施需求及進展情況在公司並表子公司範圍內調整實施主體)使用自有或自籌資金在湖北省仙桃市高新技術產業園西流河鎮化工產業園建設鼎龍仙桃光電半導體材料產業園(暫定名)，具體實施：集成電路CMP用拋光材料產業化及光電半導體柔性顯示用關鍵材料產業化項目。項目名稱和建設內容最終以相關政府主管機關的批准文件為準。
項目名稱：集成電路CMP用拋光材料產業化及光電半導體柔性顯示用關鍵材料產業化項目；
建設內容計劃為：集成電路CMP用拋光液年產2萬噸擴產項目(分兩期建設)、集成電路CMP用清洗液年產1萬噸擴產項目、OLED用PSPI年產1千噸產業化項目、OLED封裝材料INK年產600噸產業化項目，以及第三代半導體用研磨粒子、集成電路CMP高純研磨粒子、光電半導體柔性顯示用其他關鍵材料產業化項目。上述項目將根據產業化進展分二期進行。同時，公司將根據各產品的市場需求和競爭力、工藝設備的裝置水平以及工業化生產相關技術資料等方面綜合確定各產品的建設規模。(建設內容最終以相關政府主管機關的批准文件為準。)
投資規模：該項目計劃分二期建設，總投資金額約7.5-10億元人民幣，其中：一期建設規模約5億元，預計自開工建設起12-18個月內完成；二期建設規模約2.5-5億元，預計自開工建設起18-36個月內完成。總投資計劃包括：建設工程投資、設備購置及安裝投資、鋪底流動資金投資等，最終項目投資總額以實際投資為準，將根據項目實際進展情況按需投入。
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