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滬硅產業(688126.SH):子公司擬投資34.57億元建集成電路硅材料工程研發配套項目
格隆匯 01-28 18:07

格隆匯1月28日丨滬硅產業(688126.SH)公佈,公司子公司上海新昇半導體科技有限公司擬在中國(上海)自由貿易試驗區臨港新片區建設“集成電路硅材料工程研發配套”項目,該項目計劃總投資約34.57億元。

該項目為“集成電路硅材料工程研發配套”項目,該項目計劃建設用地面積為66,757平方米,建設集研發綜合性辦公樓、研發中試線、測試驗證平台、試驗室、倉庫、動力站、電力配套等公輔設施,以及員工單身公寓、餐廳等生活配套設施。項目計劃與上海集成電路材料研究院有限公司聯合承擔國家集成電路材料技術創新中心項目,擬建設一座硅材料工程技術研發實驗基地,包括向第三方提供服務的公共檢測平台等。

此次投資符合國家政策以及公司的長期發展規劃,有利於完善公司的產業佈局,能夠鞏固公司的核心競爭力。項目的建成將可徹底改變我國在硅材料工程研究與應用方面的不足,帶動國內硅材料配套產業的發展,帶動區域科技創新,同時可以有效帶動當地相關硅材料上下游產業的持續創新。

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