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半導體板塊午後拉昇 消息稱部分晶圓代工價漲超50%
格隆匯 06-04 13:27

格隆匯6月4日丨半導體板塊午後拉昇,上海貝嶺漲停,富瀚微、富滿電子、全志科技、賽微電子漲超10%,瑞芯微、長電科技、晶豐明源、北京君正、滬硅產業等集體大漲。

日前,有消息稱全球幾大晶圓代工廠將二季度代工價較上一季度再次上調10-20%,整體漲幅與第一季度相似。但從個別合同來看,部分代工價漲幅高達50%。

國信證券研報稱,產業鏈晶圓及封測端遊繼續保持訂單飽滿,同時對上游半導體設備端採購週期顯現拉長,部分關鍵設備訂單已排到三季度,短期內半導體產能無法快速擴張,因此供需結構緊張進一步加劇。半導體景氣度高企,國內製造端並進一步擴產成熟製程,重點關注相關產業鏈投資機遇。

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