滬電股份(002463.SZ):擬新建應用於半導體芯片測試及下一代高頻高速通訊領域的高層高密度互連積層板研發與製造項目
格隆匯 2 月 1日丨滬電股份(002463.SZ)公佈,公司於2021年2月1日召開的第六屆董事會第二十四次會議審議通過了《關於投資新建應用於半導體芯片測試及下一代高頻高速通訊領域的高層高密度互連積層板研發與製造項目的議案》。
項目名稱:應用於半導體芯片測試及下一代高頻高速通訊領域的高層高密度互連積層板研發與製造項目。
建設地點:位於江蘇省蘇州市崑山市玉山鎮東龍路1號的公司青淞廠區預留用地。
總投資額:該項目投資總額約為19.8億元人民幣,包括基礎建設投入、設備投入、鋪底流動資金等。
該項目將分階段實施,本項目總建設期計劃為4年。
產品方案和生產規模:本項目計劃年產6250平方米應用於半導體芯片測試領域的高層高密度互連積層板以及165000平方米應用於下一代高頻高速通訊領域的高層高密度互連積層板。
該項目預估年營業收入約24.8億元人民幣,其中應用於半導體芯片測試領域的產品營業收入約為5億元人民幣,應用於半下一代高頻高速通訊領域的產品營業收入約為19.8億元人民幣;扣除總成本費用和銷售税金及附加後的利潤總額約為4.7億元人民幣;考慮所得税,税率以15%計算,淨利潤約為4億元人民幣。
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