華虹半導體(01347.HK)上半年淨利跌58%至3810萬美元 毛利率跌至23.6%
格隆匯 8 月 11日丨華虹半導體(01347.HK)公佈半年度業績，截至2020年6月30日止年度，公司實現銷售收入為4.282億美元，同比減少5.0%；毛利率由31.6%下降8.0個百分點至23.6%；母公司擁有人應占期內溢利3810萬美元，同比減少58.0%；基本每股盈利0.030美元。
公告稱，銷售收入減少主要由於平均銷售價格下降及智能卡芯片和超級結產品需求減少，部分被MCU與電源管理產品需求增加所抵銷。
2020年上半年受全球性疫情影響，全球半導體市場經歷了較為不同程度的衝擊。影響雖然至今仍沒有結束，但部分較早經歷疫情的地區產業正逐步復甦。在公司股東、顧客、供應商及全體員工的共同努力下，二季度業績已開始穩健回升，環比上漲11%。
疫情背景下，防疫用品出貨量大漲，帶動公司MCU產品上半年出貨迅猛增長，創造了較好的業績。智慧卡晶片方面，隨着國內疫情得到良好的控制，國內市場需求在第二季度逐漸恢復。同時，因產品的高容量存儲發展趨勢，我司於無錫12寸廠積極開發90納米嵌入式快閃記憶體工藝，在上半年已經進入量產，為掌握未來市場機會起到了關鍵作用。隨着較多產品陸續認證以及12寸產能持續擴充，公司將穩定並進一步擴大eNVM市場的營收能力。
分立器件繼續保持穩定發展，儘管受到疫情衝擊影響，但在公司豐富的功率器件工藝種類、優越的技術品質保障以及較廣泛的客户羣體條件下，二季度功率器件出貨量表現亮眼，實現了出貨量雙位數的環比增長。其中，SGT-MOSFET與IGBT出貨量雙雙創出了歷史新高。
於2019年第四季度順利進入投產階段的華虹無錫12寸廠在2020年上半年運行進展一切順利。平台產品方面，90納米eNVM、65納米Logic&RF工藝平台、分立器件均已順利進入量產階段。IC+Power的產品線佈局與戰略得到順利實施，確保了公司在未來能夠持續保持高水準的服務與豐富的產品線供應。
展望未來，公司8寸晶圓廠功率分立器件、嵌入式快閃記憶體MCU、電源管理晶片及手機射頻IC的業務持續發展，12寸晶圓廠繼續堅定不移地執行IC+Power戰略。我們將繼續實施8+12晶圓差異化技術的企業發展策略，為客户提供更優質的差異化技術服務。
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