A股異動丨晶方科技漲停 晶圓廠產能吃緊 封測廠商滿載
格隆匯12月11日丨晶方科技(603005.SH)漲停,報38.5元,總市值88.4億元。

據報道,從今年下半年起,晶圓廠產能就開始變得緊俏,Nor flash、ETC、指紋、攝像頭(CIS)、礦機、手機等芯片產品的訂單持續火爆,而下游的國內各大封裝廠也都是“滿產”的狀態,甚至需要排隊一個月。按照芯片生產流程,一般在晶圓廠投片三四個月後,就到了封測階段。目前,境內外各大晶圓廠產能依然吃緊,部分8英寸晶圓廠明年的產能也在持續被預定。據此,有多位封裝界人士樂觀估計,以現在的情形看,封裝行情會延續到2020年四季度。有機構預計,僅華為海思到2023年採購成本就約達160億美元,其中封測訂單市場空間可望達到40億美元。而在智能手機、無線耳機等消費電子領域對需求不斷高漲的助推下,封測行業有望迎來較確定的業績高峯。
晶方科技專注於傳感器領域的封裝測試業務,擁有多樣化的先進封裝技術,同時具備8英寸、12英寸晶圓級芯片封裝技術規模量產封裝能力,封裝產品主要包括影像傳感器芯片、生物身份識別芯片、微機電系統芯片(MEMS)、環境光感應芯片、醫療電子器件、射頻芯片等。
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