工信部:将持续推进工业半导体材料和芯片等产业发展
国家工信部於昨日(8日)表示,下一步工信部及相关部门将持续推进工业半导体材料、芯片、器件及IGBT模块产业发展,根据产业发展形势,调整完善政策实施细则,更好的支持产业发展。
通过行业协会等加大产业链合作力度,深入推进产学研用协同,促进中国工业半导体材料、芯片、器件及IGBT模块产业的技术迭代和应用推广。
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