頎中科技(688352.SH):已將銅鎳金凸塊擴展應用在顯示驅動芯片
格隆匯7月23日丨頎中科技(688352.SH)在互動平台表示,公司已將銅鎳金凸塊擴展應用在顯示驅動芯片,滿足市場對更具性價比的封裝解決方案的需求,擴充公司現有的銅鎳金產能,同時公司為了完善非顯示類芯片封測製程建設,提升非顯示類業務全製程服務能力,擴充非顯示類業務CP產能,新增BGBM/FSM、Cu Clip、載板覆晶封裝製程產能建設。此外公司持續加大研發投入,鼓勵研發團隊開發適應市場需求的產品,促進科研、開發、生產、市場的結合,截至2024年12月31日,公司已取得127項授權專利和1項軟件著作權,具體請參閲公司的定期報吿。
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